Internship Overview: We welcome young researchers to join us to explore cutting-edge electronic technologies in this internship opportunity. Our research topics cover the front-end integrated circuit design and the back-end system demonstration. The term of internship is 3 months at most, though the research can be extended in any form of cooperation when the participants go back home.

About the project: This project aims at a time-to-digital converter (TDC) system with picosecond time resolution which corresponds to the spatial resolution around millimeters. By using pulse-type time-of-flight (ToF) technology and a TDC circuit, we try to convert the time difference between two pulses in the level of picosecond. This technology can be applied in the fields of positron tomography (PET) or high precision all digital phase locked loop (ADPLL). For the ToF-PET, TDC can effectively improve the image quality or the resolution of PET images for tumor identification. For ADPLL, a high resolution TDC would help the phase comparison to synthesize a stable frequency. This technology can be applied to optical or acoustic pulse waves, and has a wide range of application potential in medical imaging technology. The TDC system can be implemented by FPGA or CMOS ASIC design style. For quick verification, FPGA would be preferred. However, a full-custom design may give better performance while costs longer time in design and fabrication. Applicants can also help to test the performance of the available chips developed by other researchers. In addition to the research and development of integrated circuits, this project also develops a virtual reality system, which presents the electronic signals and the three-dimensional medical images in an immersive virtual space to facilitate intuitive operation by professionals.

Qualifications: We welcome motivated individuals who meet the following criteria:
1. enrolled in a relevant undergraduate or graduate program;
2. having backgrounds and experience in electronic circuit design;
3. positive attitude and effective studying in a collaborative team.

  • Field: Engineering
  • School: Feng Chia University
  • Organizer: Department of ELectronic Engineering
  • Period of Apply: 2024/01/01 - 2024/12/31
  • Term: 2024/01/01 - 2024/09/30
  • Fee: There are no registration fees or tuition fees. However, applicants must bear their own living and accommodation expenses during their stay in Taichung City.
  • Website of Program:
  • Contact Person:Don-Gey Liu
  • Phone:+886-937205484