1. This program will provide experiments and analysis of plasma and thin-film technologies applied to the semiconductor manufacturing process, including the growth of some metal, oxide, and nitride films. The plasma analysis during the thin film deposition will be introduced.
2. It's at least 2 to 3 months for the students who join our program.
3. The applicants must have a background in material science and engineering, physics, plasma related field.
4. The applicants must have a bachelor's degree or higher.
![]()
- Field: Engineering
- School: Ming Chi University of Technology
- Organizer: Department of Materials Engineering
- Period of Apply: 2026/07/01-2026/12/31
- Term: 2026/07/01-2026/12/31
- Fee: You have to cover the living expenses yourself.
- Contact Person：Jyh-Wei Lee
- Email：jefflee@mail.mcut.edu.tw
- Phone：+886-926328987