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This project aligns with the national "Five Trusted Industry" policy, with a strategic focus on the semiconductor sector. The primary goal is to invite promising young talents from Vietnam to Taiwan to gain in-depth knowledge and hands-on experience in the structural design, simulation, and development of advanced electronic packaging through professional courses and industrial internships. The anticipated outcome is to cultivate international semiconductor R&D professionals with immediate job-ready skills. Furthermore, the project aims to attract these participants to pursue advanced degrees or careers in Taiwan, thereby strengthening the academic and industrial ties between Taiwan and Vietnam.

  • Field: Engineering
  • School: National United University
  • Organizer: Department of Mechanical Engineering
  • Period of Apply: 2026/07/01-2026/9/30
  • Term: 2026/07/01; 2026/07/15; 2026/07/29; 2026/08/12; 2026/08/26; 2026/06/03; 2026/09/09; 2026/09/23; 2026/10/07; 2026/10/21
  • Fee: TEEP Internship Scholarship: NT$180,000

    (NT$15,000 per month × 3 months × 4 interns)
  • Contact Person:Ching-Feng Yu
  • Email:cfyu@nuu.edu.tw

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