1. Project Description:
This research project develops a novel laser-programming strategy. By precisely controlling laser energy density, the system enables multi-dimensional phase transitions while maintaining >60% visible-light transmittance: low-energy 2D translucent whitening, medium-energy 3D foaming (height differential up to 1162 μm, volume expansion 465%), and high-energy gradient carbonization. These features support advanced applications in dynamic information encryption (water-triggered reversible hiding / dual-laser decryption with auto-destruct security), high-security anti-counterfeiting (3D Braille, dynamic QR codes), and flexible electronics (piezoresistive + optical dual-mode sensors for pressure, temperature, and humidity).

Interns will participate in hands-on experiments including composite film fabrication, laser multi-threshold patterning, material characterization (XPS, Raman, FTIR, 3D confocal microscopy), sensor prototyping, and data analysis. The project also explores material optimization (e.g., alternative photothermal agents or polymer matrices) and integration with printed circuits/microfluidics to create fully flexible “smart skin” and electronic labels with dual optical-electrical verification.

2. Duration:
Minimum 3 months, up to 6 months (flexible start dates; recommended period: March–December 2026). .

3. Participation Requirements:
-Open to international undergraduate or graduate students (Master’s or Ph.D. level preferred) and industry-academia interns.
-Preferred (but not mandatory) academic background in polymer science, materials science, opto-mechatronics, mechanical/electrical engineering, or related fields.
-Basic laboratory experience in materials synthesis, laser processing, or sensor testing is an advantage.
-Good English communication skills; basic Mandarin is helpful but not required.
-Applicants must meet TEEP eligibility criteria (non-Taiwan/China nationality, not currently enrolled as a degree-seeking or exchange student in Taiwan, and not holding a Ph.D. degree if applying for the TEEP scholarship).

4. Financial Support & Scholarship:
Eligible participants can apply for the Taiwan Experience Education Program (TEEP) scholarship administered by Taiwan’s Ministry of Education.
a. Monthly stipend: Up to NT$15,000 (approximately USD 460–500, exact amount determined by the program director based on performance and project needs).
b. The scholarship supports living expenses during the internship.
c. Note: TEEP does not cover airfare, visa fees, or insurance. Participants are responsible for their own round-trip travel and mandatory health/travel insurance.

5. Self-Funded Expenses
a. Accommodation: Participants must arrange their own housing (university dormitories in Taichung are available at approximately NT$5,000–8,000 per month; private rentals are also options).
b. Meals & daily living: Estimated NT$8,000–12,000 per month (food, transportation, etc.).
c. Other costs: Lab safety training, minor consumables, and personal expenses.
The TEEP stipend is designed to help cover these costs, but participants should prepare additional personal funds.

6. Other Important Notes
a. The internship will be conducted at a research laboratory in Taichung, Taiwan.
b. All participants must comply with laboratory safety regulations and obtain a valid visitor visa or ARC (Alien Resident Certificate) before arrival.
c. The host institution will provide guidance on visa application, airport pickup, and orientation.
d. Opportunities to join seminars, cultural activities, and Chinese language courses may be available through TEEP.
e. This project emphasizes interdisciplinary collaboration and innovation; outstanding interns may have opportunities for co-authorship on publications or future Ph.D. pathways.

Interested candidates are welcome to contact the project supervisor with their CV and a brief statement of interest. We look forward to hosting talented international interns and contributing to cutting-edge research in advanced materials and flexible electronics!