Application Period: June to December 2026
Scholarship: A stipend of NT$15,000 (approximately USD 472) per month to support living expenses.
Program Duration: 3 months
Meal and Accommodation: Participants are responsible for their expenses.
• Dormitory: Four-person room at approximately NT$3,000 per month (around USD 95).
• Meals: Estimated cost of NT$80–100 per meal (around USD 3–4).
Applicant requirements: Applicants who are studying for engineering majors at university will be given priority and must be proficient in English.
Insurance: TEEP interns must arrange their insurance coverage.
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- Field: Engineering
- School: Da-Yeh University
- Organizer: (1) Bachelor’s Program of Semiconductor；(2) Department of Biomedical Engineering
- Period of Apply: 2026/06/01-2026/12/31
- Term: 2026/06/01-2026/12/31
- Fee: We would like to inform you about the fees you will need to cover during your TEEP period at Da-Yeh University:
1. Dormitory Fees: The approximate cost for a four-person room is around 3,000 New Taiwanese Dollars per month.
2. Insurance: Students must have valid insurance for the duration of their stay at Da-Yeh University. We ask that all students obtain insurance before arriving at Da-Yeh University.
3. Miscellaneous Fees: This may include costs such as books and other related expenses.
Please note that living expenses are not included in the above list.
- Contact Person：Sin-Liang Ou
- Email：slo@mail.dyu.edu.tw
- Phone：+886-4-8511888 ext. 2608