This program focuses on the application of corrosion-resistant thin film materials in semiconductor equipment, particularly under highly corrosive environments such as dry etching processes. Participants will engage in material design, thin film deposition, and characterization.
Students will gain hands-on experience in thin film fabrication, materials analysis, and plasma etching resistance testing. Through this program, participants will develop a comprehensive understanding of advanced materials used in semiconductor manufacturing.
Participation in this program is free of charge.
1. Application Period: May to December 2026
2. Scholarship: NT$16,000 (approximately USD 500) per month to support living expenses
3. Program Duration: 4 months
4. Eligibility: Undergraduate and graduate students with backgrounds in engineering, materials science, mechanical engineering, chemical engineering, or related fields
5. Language Requirement: Communication can be conducted in either Chinese or English
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- Field: Engineering
- School: Da-Yeh University
- Organizer: Department of Electrical Engineering
- Period of Apply: 2026/05/01-2026/12/31
- Term: 2026/05/01-2026/12/31
- Fee: Participants are responsible for the following expenses during their stay:
1. Meals and Accommodation:
o Meals: Approximately NT$80–100 per meal (around USD 3–4)
o Dormitory: Shared room (4 persons) at approximately NT$3,000 per month (around USD 95)
2. Insurance:
Participants must obtain valid insurance coverage prior to arrival, which must remain valid throughout the program period.
3. Miscellaneous Fees:
This may include books and other study-related costs.
- Contact Person：Shih-Yung Huang
- Email：syh@mail.dyu.edu.tw