This program focuses on Advanced Packaging Materials and Interface Engineering, with an emphasis on TSV/3DIC packaging systems. It aims to systematically investigate the interfacial properties, structural stability, and thermomechanical compatibility of key functional materials. The research scope includes the design and application of copper seed layers and negative thermal expansion (NTE) materials, with the goal of enhancing the reliability and performance of advanced packaging technologies.

The program is structured as a six-month international research exchange, integrating experimental work with advanced materials analysis. Research topics include electroless copper deposition, interface optimization, surface modification, and crystallographic orientation control, along with their underlying mechanisms and performance evaluation. In addition, the integration strategies of NTE materials into advanced packaging systems will be explored to address thermal stress and long-term reliability challenges.

Participants will engage in hands-on research and utilize a range of advanced characterization techniques, including X-ray diffraction (XRD), scanning electron microscopy (SEM), thermomechanical analysis (TMA), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS), to investigate interfacial structures and material properties. The program emphasizes the correlation between material structure, interfacial interactions, and device reliability, fostering cross-scale analytical and problem-solving capabilities.

The exchange program is scheduled from July 2026 to December 2026 and is open to international students in materials science, chemical engineering, and electronic engineering. Collaborating institutions include universities in Italy, Japan, Israel, and India (e.g., University of Bologna, University of Tokyo, University of Santo Tomas, and IIT-BHU), providing diverse opportunities for international academic exchange.

Participants are required to complete a research report and present their results through academic seminars and technical discussions. This program aims to cultivate interdisciplinary talent with expertise in materials design, interface engineering, and advanced packaging integration, strengthen international collaboration, and enhance global competitiveness in semiconductor packaging and functional materials research.

The total funding requested for this program is NTD 300,000, of which NTD 240,000 will be allocated to international student scholarships (NTD 20,000 per person per month for 6 months), and NTD 60,000 will be used for administrative and operational expenses, including experimental materials, travel, and assistant labor costs. All expenditures will be managed in accordance with the reimbursement regulations of the Ministry of Education, and a detailed financial statement and final report will be submitted upon project completion.