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This short-term exchange program provides up to 3 students with the opportunity to experience the academic activities in Taiwan for up to six months. A monthly living stipend of NT$15,000 will be provided during the exchange period. Both undergraduate and graduate students are eligible to apply, preferably with an engineering background. Applicants should have proficiency in either Chinese (CEFR A2 or above) or English (CEFR B1 or above). Participants may choose to stay in on-campus dormitories. You may contact the program coordinator in advance to reserve a dorm room if needed. Alternatively, participants may arrange their own short-term off-campus accommodation near the university.

Through this program, students will participate in semiconductor electronic packaging testing and be involved in planning related processes and experiments. Students will also learn to fabricate microprobe cards with nickel-cobalt alloy plating. Students may have a cutting-edge semiconductor fabrication experience and the possibility of studying a graduate program at Da-yeh University.

  • Field: Engineering
  • School: Da-Yeh University
  • Organizer: Department of Mechanical and Automation Engineering
  • Period of Apply: 2026/04/15-2026/09/30
  • Term: 2026/06/01-2026/12/31
  • Contact Person:Yang-Chieh Fu
  • Email:ycfu@mail.dyu.edu.tw

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