Our research group is at the forefront of engineering innovation, focusing on the strategic integration of Computer-Aided Engineering (CAE) simulation technologies with advanced Artificial Intelligence (AI) frameworks. As industries move toward the era of Digital Twins and autonomous design, the synergy between physics-based modeling and data-driven intelligence has become a critical frontier. We are currently seeking highly motivated, passionate, and inquisitive individuals to join our laboratory and contribute to this transformative field of study.

>>Current research topics:

(1)CAE-simulation (ANSYS, COMSOL and Moldex 3D)

(2)AI-Assisted for IC defect detection 　

(3)Thermal stress for IC packaging and molding

>>Duration: 2 to 6 months

>>Start Date: Flexible (to be determined based on the selected candidates)

>>Eligibility: The project is open to up to 2 undergraduate students or master students

>>Skills and Knowledge Required: Familiar with Python and deep learning frameworks or CAE simulation; Interested in speech and

text processing.

>> Financial Support: Up to 15,000 TWD per month (approximately 450 USD)

Application Process: Interested applicants should submit:

1. A resume or CV detailing relevant skills and experience

2. A cover letter expressing interest and motivation for the project

3. Transcripts (for students)

How to Apply: Please send your application to simonshih@stust.edu.tw with the subject line: "AI Computer Vision Application: Semiconductor Packaging Defect Inspection".