1. The TEEP scholarship will provide 20,000 (NTD) each month for 6 months (maximum duration) 2. Student needs to pay the following fees: Accommodation fee (about 4,000 each month) Living expense flight tickets The scheme of the project is to employ the solid-state-reaction and multilayer ceramic capacitor (MLCC) technologies to fabricate A2+B4+O3-based high-entropy ferroelectric ceramics for high-power energy storage applications.
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- Field: Engineering
- School: Fu Jen Catholic University
- Organizer: Physics
- Period of Apply: 2026/04/01 - 2026/04/31
- Term: 2026/09/01 - 2027/02/28
- Fee: Student needs to pay the following fees:
1. accommodation fee (about 4,000 each month)
2. living expense
3. flight tickets
No registration fee - Website of Program: www.phy.fju.edu.tw/wp-content/uploads/2025/05/Research-group-posterTu.pdf
- Contact Person：CHI SHUN TU
- Email：chishun.tu@gmail.com
- Phone：(02)29053560