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This project focuses on smart healthcare and sensor IC design and aims to recruit students from related fields such as electrical engineering, computer science, photonics, and biomedical engineering. Participants will engage in a 2–6 month international research and hands-on training program. The research topics include advanced technologies such as biomedical sensing IC Chip, flexible electronic skin, motion sensing technologies, and edge AI-based sensors. The objective of the program is to cultivate interdisciplinary integration capabilities, training students in areas ranging from circuit design and signal processing to application validation, thereby developing expertise in smart healthcare IC development and system integration. The primary target participants are students from Asia, Europe, and the Americas with backgrounds in electrical engineering and biomedical-related fields. Through laboratory-based research projects, participants will be involved in sensor fabrication, system testing, and AI algorithm implementation. The program will be carried out in two phases: the first phase focuses on IC design, AI signal processing, and introductory circuit concepts; the second phase involves sensor IC fabrication and wearable system integration. • Duration: More than 2 Months (Flexible start dates). • Stipend: NTD 20,000 per month. • Eligibility: Undergraduate, graduate, master's, and PhD students in EE, CS, Biomedical, or related fields with basic English skills.

  • Field: Engineering
  • School: National Tsing Hua University
  • Organizer: Department of Biomedical Engineering
  • Period of Apply: 2026/04/01-2026/12/31
  • Term: 2026/04/01-2026/12/31
  • Fee: Accommodation Fee
  • Website of Program: wangtw.wixsite.com/nthu-bioelectronics
  • Contact Person:Ting-Wei Wang
  • Email:wangtw@mx.nthu.edu.tw
  • Phone:03-5715131 ext 35498

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