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🚀 JOIN OUR PROGRAM: Modelling & Testing for Reliability in Semiconductors 🔬✨ ✅ Why This Matters Semiconductors power the technologies shaping our world—from consumer electronics to critical infrastructure. Their reliability directly impacts performance, safety, and innovation. This program offers a unique opportunity to gain hands-on experience in testing, design, and physics-based modeling, bridging the gap between academic learning and real-world engineering. ⚠️ The Challenge: Reliability Is Complex Ensuring reliability goes far beyond standard testing. It requires: Insight into failure mechanisms and material behavior Expertise in circuit design and hardware validation Development of accurate, physics-based simulation models This program equips you to tackle these challenges using industry-relevant tools and methodologies. 🚀 Program Tracks 🔧 Circuit Design & PCB Development Design and build practical testing systems for semiconductor devices: Develop schematics using Altium, Cadence, SPICE Design, fabricate, and test PCBs Implement digital test circuits for reliability evaluation 👉 Outcome: Hands-on hardware development and exposure to professional EDA tools 💻 Physics-Based Software Development Build computational tools grounded in physical principles: Develop simulations using Finite Element Method (FEM) Integrate models into interactive GUI applications Validate models using experimental or benchmark data 👉 Outcome: Experience in simulation-driven engineering and scientific software development 🎓 Who Should Apply? We are looking for motivated students with a passion for innovation: Undergraduate, Master’s, or PhD students Background in Engineering, Physics, Computer Science, or related fields Basic knowledge of programming, CAD, or circuit design Strong interest in research, problem-solving, and technology development ✨ Why Join This Program? ✔ Gain practical, industry-relevant experience ✔ Work on real-world semiconductor challenges ✔ Develop a strong technical and research portfolio ✔ Prepare for careers in electronics, reliability engineering, and advanced R&D Apply Now — Limited Seats Available! Shape the future of reliable semiconductor systems! References: 1. Cher Ming Tan, Debraj Banerjee, and Rajarshi Sarkar "Physics-Based Modeling Toolkit for Predicting Integrated Circuit Interconnections Electromigration Lifetime" International Reliability Physics Symposium (IRPS), 2026 2. Rajarshi Sarkar, Cher Ming Tan, Debraj Banerjee, "A plausible explanation for the p-metal phenomenon in the electromigration degradation of VLSI interconnects" International Reliability Physics Symposium (IRPS), 2026

  • Field: Others
  • School: Chang Gung University
  • Organizer: Center for Reliability Sciences & Technologies
  • Period of Apply: 2026/06/01-2026/11/30
  • Term: 6 months
  • Fee: Accommodation fees must be paid by the individual.
  • Website of Program: cgucrest.org
  • Contact Person:Abdul Shabir
  • Email:abdulshabir@outlook.com
  • Phone:032118800#3872

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