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Academic Qualifications: Undergraduate and graduate students. Major: Biomedical Engineering, Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or related majors. Language: English A monthly stipend of NT$15,000 for a period of 2 to 6 months. Stipend support may cover living expenses, but additional costs such as accommodation and personal expenses may apply. Participants are responsible for arranging their own travel, visa, and health insurance. While we assist in finding accommodation, availability is subject to openings. If you are interested in joining our research group in the TEEP program, please send your resume along with a brief cover letter to kkliu@mx.nthu.edu.tw

  • Field: Engineering
  • School: National Tsing Hua University
  • Organizer: Department of Biomedical Engineering and Environmental Sciences
  • Period of Apply: 2026/04/01-2026/07/31
  • Term: 2026/01/01-2026/12/31
  • Website of Program: kengkuliu.wixsite.com/liugroup
  • Contact Person:Keng-Ku Liu
  • Email:kkliu@mx.nthu.edu.tw
  • Phone:03-5715131 ext34327

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