This project aims to develop a new type of liquid crystalline epoxy resin (LCR) encapsulation material to enhance the reliability and durability of semiconductor packaging technologies. Liquid Crystalline Epoxy Resin (LCR) is a high-performance polymer material with excellent chemical stability, mechanical strength, and electrical properties, widely used in electronic packaging, coatings, and optical materials. During curing, the epoxy groups react with hardeners to form a three-dimensional network, imparting high-temperature resistance, corrosion resistance, and superior mechanical strength. LCR's excellent fluidity makes it ideal for precise encapsulation, allowing for accurate filling of complex molds. It has become a key material in semiconductor packaging. This project will focus on modifying the structure of LCR and creating composites to improve thermal conductivity, flexibility, and stability to meet the high demands of modern electronic devices. The project requires expertise in polymer synthesis and organic chemistry. The research will begin after July 2025 and will last for 6 months.